Aluminum Target for Sputtering and Coating Metal with Customized Size

-Aluminum Target for Sputtering and Coating Metal with Customized Size according to customer’s requirement are manufactured by hot isostatic pressure technology, the grain size is smaller than 100um, we can ensure the sputtering targets or cathodes uniform and compact inner structure, tiny titanium particles were uniformly distributed in aluminum base.

Product Details

Aluminum Target for Sputtering and Coating Metal with Customized Size

Aluminum Sputtering Target:
   Aluminum Sputtering Target has lightweight, good malleability, good conductivity, high thermal conductivity and heat resistance. Aluminum sputtering target is used in vacuum coating.
Product Description

-Aluminum Target for Sputtering and Coating Metal with Customized Size according to customer’s requirement are manufactured by hot isostatic pressure technology, the grain size is smaller than 100um, we can ensure the sputtering targets or cathodes uniform and compact inner structure, tiny titanium particles were uniformly distributed in aluminum base.

-Aluminum Target for Sputtering and Coating Metal with Customized Size has particularly homogeneous microstructure and outstanding surface quality are mainly used for metallization in thin-film transistors for TFT-LCD monitors, television sets, cell phone displays and CD. Our materials are applied using either the reactive magnetron sputtering method or arc evaporation and form in a nitrogen atmosphere a nitride hard material layer on the substrate.

-We will do chemical and physical analysis to each batch of product, and send the COA to you. Ensure that we provide each product to meet your requirements. The purity of aluminum sputtering target we supply is 99.9%~99.9999%. 

Product Features 

High ductility

High thermal conductivity

Homogeneous microstructure

Unbeatable level of material purity

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